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Patent Assignment Details
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Reel/Frame:021401/0260   Pages: 2
Recorded: 08/13/2008
Attorney Dkt #:04329.3238
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10771060
Filing Dt:
02/04/2004
Publication #:
Pub Dt:
10/13/2005
Title:
Polishing pad and method of manufacturing semiconductor devices
Assignor
1
Exec Dt:
08/06/2008
Assignee
1
6-10 TSUKIJI 5-CHOME
CHUO-KU, TOKYO, JAPAN
Correspondence name and address
FINNEGAN, HENDERSON, FARABOW ET AL.
RICHARD V. BURGUJIAN
901 NEW YORK AVENUE, N.W.
WASHINGTON, DC 20001-4413

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