Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021470/0775 | |
| Pages: | 4 |
| | Recorded: | 09/02/2008 | | |
| Attorney Dkt #: | 09864/0210276-US0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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12281430
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Filing Dt:
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12/02/2008
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Publication #:
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Pub Dt:
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12/10/2009
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Title:
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LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER
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Assignees
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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| 158-1, OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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JOSEPH R. ROBINSON
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P.O. BOX 770, CHURCH STREET STATION
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NEW YORK, NY 10008-0770
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