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Patent Assignment Details
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Reel/Frame:021527/0052   Pages: 4
Recorded: 08/28/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12230353
Filing Dt:
08/28/2008
Publication #:
Pub Dt:
09/10/2009
Title:
Polishing compound for semiconductor wafer polishing and polishing method
Assignors
1
Exec Dt:
06/30/2008
2
Exec Dt:
06/30/2008
3
Exec Dt:
07/16/2008
4
Exec Dt:
07/22/2008
5
Exec Dt:
07/22/2008
Assignees
1
11-1 KAMEIDO 9-CHOME
KOTO-KU, TOKYO (50%), JAPAN 136-8515
2
2647 HAYAKAWA, AYASE-SHI
KANAGAWA (50%), JAPAN 252-1123
Correspondence name and address
H. JAY SPIEGEL
P.O. BOX 11
MOUNT VERNON, VIRGINIA 22121

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