Patent Assignment Details
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| Reel/Frame: | 021539/0804 | |
| Pages: | 5 |
| | Recorded: | 09/17/2008 | | |
| Attorney Dkt #: | R2184.0678/P678 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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12211862
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Filing Dt:
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09/17/2008
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP CUT FROM THE SEMICONDUCTOR WAFER, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
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Assignee
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| 3-6, NAKAMAGOME 1-CHOME, OHTA-KU |
| TOKYO, JAPAN 143-8555 |
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Correspondence name and address
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DICKSTEIN SHAPIRO LLP
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1825 EYE STREET NW
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WASHINGTON, DC 20006-5403
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