Patent Assignment Details
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| Reel/Frame: | 021543/0060 | |
| Pages: | 3 |
| | Recorded: | 09/17/2008 | | |
| Attorney Dkt #: | 1035-807 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12212089
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Filing Dt:
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09/17/2008
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Publication #:
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Pub Dt:
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07/23/2009
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Title:
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INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD
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Assignee
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| 22-22 NAGAIKE-CHO, ABENO-KU, |
| OSAKA-SHI, OSAKA, JAPAN 545-8522 |
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Correspondence name and address
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NIXON & VANDERHYE, PC
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901 NORTH GLEBE ROAD, 11TH FLOOR
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ARLINGTON, VA 22203
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