Patent Assignment Details
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| Reel/Frame: | 021564/0911 | |
| Pages: | 6 |
| | Recorded: | 09/22/2008 | | |
| Attorney Dkt #: | 125155.00137 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/15/2011
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Application #:
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12235000
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Filing Dt:
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09/22/2008
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Publication #:
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Pub Dt:
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03/25/2010
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Title:
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METHOD OF FORMING A WAFER LEVEL PACKAGE WITH RDL [[BUMP]] INTERCONNECTION OVER ENCAPSULANT BETWEEN BUMP AND SEMICONDUCTOR DIE
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ROBERT D. ATKINS
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QUARLES & BRADY LLP
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TWO NORTH CENTRAL AVENUE
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PHOENIX, AZ 85004-2391
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