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Reel/Frame:021599/0813   Pages: 6
Recorded: 09/29/2008
Attorney Dkt #:04173.0526
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/26/2013
Application #:
11547715
Filing Dt:
09/29/2008
Publication #:
Pub Dt:
01/15/2009
Title:
PRINTED CIRCUIT BOARD ASSEMBLED PANEL, UNIT SHEET FOR PACKAGING A PRINTED CIRCUIT BOARD, RIGID-FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME
Assignors
1
Exec Dt:
10/06/2006
2
Exec Dt:
10/06/2006
3
Exec Dt:
10/06/2006
4
Exec Dt:
10/06/2006
5
Exec Dt:
10/06/2006
6
Exec Dt:
10/06/2006
7
Exec Dt:
10/06/2006
Assignee
1
1-1, KAGO-CHO 1-CHOME
ICHIGAYA, SHINJUKU-KU, TOKYO, JAPAN 162-0062
Correspondence name and address
FINNEGAN HENDERSON
901 NEW YORK AVENUE, NW
WASHINGTON, DC 20001

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