Patent Assignment Details
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Reel/Frame: | 021733/0940 | |
| Pages: | 2 |
| | Recorded: | 10/23/2008 | | |
Attorney Dkt #: | MENG 1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12257225
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Filing Dt:
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10/23/2008
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Publication #:
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Pub Dt:
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07/02/2009
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Title:
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BGA PACKAGE MODULE DESOLDERING APPARATUS AND METHOD
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Assignee
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NO. 141, LANE 351, TAIPING RD., SEC. 1, TSAO TUEN |
NAN TOU, TAIWAN |
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Correspondence name and address
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BROWDY AND NEIMARK, P.L.L.C.
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624 NINTH STREET, NW, SUITE 300
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WASHINGTON, DC 20001-5303
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