Patent Assignment Details
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| Reel/Frame: | 021795/0858 | |
| Pages: | 7 |
| | Recorded: | 11/06/2008 | | |
| Attorney Dkt #: | 81716.0188(RECORDATION) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/15/2011
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Application #:
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12204677
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Filing Dt:
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09/04/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, PRINTED CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND POWER SUPPLY WIRING STRUCTURE
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Assignees
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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| 3-16-11 NISHI SHIMBASHI |
| MINATO-KU, TOKYO, JAPAN |
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| 7-3, AKASAKA 9-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| 7-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO, JAPAN 163-0722 |
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| 6-2, OTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-0004 |
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| 2-1 KANDA-CHO |
| OGAKI, GIFU, JAPAN 503-8604 |
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| 2-1074-38 KOHAN |
| HIGASHIYAMATO-SHI, TOKYO, JAPAN 207-0002 |
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| 120-12 KATAKURA-MACHI |
| HACHIOUJI-SHI, TOKYO, JAPAN 192-0914 |
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Correspondence name and address
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HOGAN & HARTSON L.L.P.
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1999 AVENUE OF THE STARS
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SUITE 1400
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LOS ANGELES, CA 90067
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