Patent Assignment Details
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| Reel/Frame: | 021802/0214 | |
| Pages: | 2 |
| | Recorded: | 11/03/2008 | | |
| Attorney Dkt #: | 139337 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12289745
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Filing Dt:
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11/03/2008
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Publication #:
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Pub Dt:
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05/06/2010
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Title:
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LAYERED CHIP PACKAGE WITH HEAT SINK
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Assignees
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| 1-13-1, NIHONBASHI |
| CHUO-KU |
| TOKYO 103-8272, JAPAN |
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK |
| SHATIN, N.T. HONG KONG, CHINA |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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