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Patent Assignment Details
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Reel/Frame:021805/0378   Pages: 8
Recorded: 11/10/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 9
1
Patent #:
Issue Dt:
08/13/2002
Application #:
09634988
Filing Dt:
08/08/2000
Title:
PLASMA VACUUM SUBSTRATE TREATMENT PROCESS AND SYSTEM
2
Patent #:
NONE
Issue Dt:
Application #:
10516455
Filing Dt:
12/03/2004
Publication #:
Pub Dt:
03/23/2006
Title:
Method and device for substrate etching with very high power inductively coupled plasma
3
Patent #:
NONE
Issue Dt:
Application #:
10516457
Filing Dt:
12/03/2004
Publication #:
Pub Dt:
10/13/2005
Title:
Heating jacket for plasma etching reactor, and etching method using same
4
Patent #:
Issue Dt:
06/06/2006
Application #:
10902582
Filing Dt:
07/30/2004
Publication #:
Pub Dt:
02/03/2005
Title:
METHOD AND APPARATUS FOR NON-AGGRESSIVE PLASMA-ENHANCED VAPOR DEPOSITION OF DIELECTRIC FILMS
5
Patent #:
NONE
Issue Dt:
Application #:
11219651
Filing Dt:
09/07/2005
Publication #:
Pub Dt:
03/09/2006
Title:
Thin substrate support
6
Patent #:
Issue Dt:
02/22/2011
Application #:
11319506
Filing Dt:
12/29/2005
Publication #:
Pub Dt:
08/10/2006
Title:
APPARATUS AND A METHOD FOR CONTROLLING THE DEPTH OF ETCHING DURING ALTERNATING PLASMA ETCHING OF SEMICONDUCTOR SUBSTRATES
7
Patent #:
NONE
Issue Dt:
Application #:
11372118
Filing Dt:
03/10/2006
Publication #:
Pub Dt:
08/24/2006
Title:
Method and apparatus for non-aggressive plasma-enhanced vapor deposition of dielectric films
8
Patent #:
Issue Dt:
07/15/2008
Application #:
11451443
Filing Dt:
06/13/2006
Publication #:
Pub Dt:
12/14/2006
Title:
METHOD OF CONTROLLING THE PRESSURE IN A PROCESS CHAMBER
9
Patent #:
NONE
Issue Dt:
Application #:
11669028
Filing Dt:
01/30/2007
Publication #:
Pub Dt:
08/23/2007
Title:
ANISOTROPIC ETCHING METHOD
Assignor
1
Exec Dt:
09/16/2008
Assignee
1
2201 S. MCDOWELL BOULEVARD
PETALUMA, CALIFORNIA 94954
Correspondence name and address
FLIESLER MEYER LLP
650 CALIFORNIA STREET, 14TH FLOOR
SAN FRANCISCO, CA 94108

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