Patent Assignment Details
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| Reel/Frame: | 021843/0345 | |
| Pages: | 3 |
| | Recorded: | 11/17/2008 | | |
| Attorney Dkt #: | POL-6547 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2009
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Application #:
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12187622
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Filing Dt:
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08/07/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Title:
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BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED THEREBY
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Assignees
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| 2-1, YAESU 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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SHRINATH MALUR
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1800 DIAGONAL RD, SUITE 370
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ALEXANDRIA, VA 22314
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