Patent Assignment Details
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| Reel/Frame: | 021853/0470 | |
| Pages: | 3 |
| | Recorded: | 11/18/2008 | | |
| Attorney Dkt #: | 03180.0487 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12206032
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Filing Dt:
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09/08/2008
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Publication #:
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Pub Dt:
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03/12/2009
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Title:
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Method for Measuring Sample, Package for Sensor Chips, and Mechanism for Fixing Sensor Chips
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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E. CHAPMAN - FHFGD
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901 NEW YORK AVE., NW
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WASHINGTON, DC 20001
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04/27/2024 04:42 AM
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