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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:021861/0869   Pages: 6
Recorded: 11/20/2008
Conveyance: RELEASE OF SECURITY INTEREST
Total properties: 35
1
Patent #:
6809269
Issue Dt:
10/26/2004
Application #:
10322527
Filing Dt:
12/19/2002
Publication #:
US20040118596
Pub Dt:
06/24/2004
Title:
CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
2
Patent #:
6828514
Issue Dt:
12/07/2004
Application #:
10354000
Filing Dt:
01/30/2003
Publication #:
US20040150969
Pub Dt:
08/05/2004
Title:
HIGH SPEED CIRCUIT BOARD AND METHOD FOR FABRICATION
3
Patent #:
6905589
Issue Dt:
06/14/2005
Application #:
10370529
Filing Dt:
02/24/2003
Publication #:
US20040163964
Pub Dt:
08/26/2004
Title:
CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
4
Patent #:
6872894
Issue Dt:
03/29/2005
Application #:
10379575
Filing Dt:
03/06/2003
Publication #:
US20040118598
Pub Dt:
06/24/2004
Title:
INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
5
Patent #:
7035113
Issue Dt:
04/25/2006
Application #:
10394107
Filing Dt:
03/24/2003
Publication #:
US20040150114
Pub Dt:
08/05/2004
Title:
MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
6
Patent #:
7023707
Issue Dt:
04/04/2006
Application #:
10394135
Filing Dt:
03/24/2003
Publication #:
US20040150101
Pub Dt:
08/05/2004
Title:
INFORMATION HANDLING SYSTEM
7
Patent #:
6958106
Issue Dt:
10/25/2005
Application #:
10409066
Filing Dt:
04/09/2003
Publication #:
US20040201136
Pub Dt:
10/14/2004
Title:
MATERIAL SEPARATION TO FORM SEGMENTED PRODUCT
8
Patent #:
6815837
Issue Dt:
11/09/2004
Application #:
10423877
Filing Dt:
04/28/2003
Publication #:
US20040183212
Pub Dt:
09/23/2004
Title:
ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
9
Patent #:
7087846
Issue Dt:
08/08/2006
Application #:
10423972
Filing Dt:
04/28/2003
Publication #:
US20040182604
Pub Dt:
09/23/2004
Title:
PINNED ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
10
Patent #:
7013563
Issue Dt:
03/21/2006
Application #:
10616932
Filing Dt:
07/11/2003
Publication #:
US20050005438
Pub Dt:
01/13/2005
Title:
Method of testing spacings in pattern of openings in PCB conductive layer
11
Patent #:
7109732
Issue Dt:
09/19/2006
Application #:
10630722
Filing Dt:
07/31/2003
Publication #:
US20050022376
Pub Dt:
02/03/2005
Title:
ELECTRONIC COMPONENT TEST APPARATUS
12
Patent #:
7063762
Issue Dt:
06/20/2006
Application #:
10643909
Filing Dt:
08/20/2003
Publication #:
US20050039840
Pub Dt:
02/24/2005
Title:
CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
13
Patent #:
6992896
Issue Dt:
01/31/2006
Application #:
10661616
Filing Dt:
09/15/2003
Publication #:
US20040150095
Pub Dt:
08/05/2004
Title:
STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
14
Patent #:
7084014
Issue Dt:
08/01/2006
Application #:
10679302
Filing Dt:
10/07/2003
Publication #:
US20050074924
Pub Dt:
04/07/2005
Title:
METHOD OF MAKING CIRCUITIZED SUBSTRATE
15
Patent #:
7211289
Issue Dt:
05/01/2007
Application #:
10737974
Filing Dt:
12/18/2003
Publication #:
US20050136646
Pub Dt:
06/23/2005
Title:
Method of making multilayered printed circuit board with filled conductive holes
16
Patent #:
7176383
Issue Dt:
02/13/2007
Application #:
10740398
Filing Dt:
12/22/2003
Publication #:
US20050133257
Pub Dt:
06/23/2005
Title:
PRINTED CIRCUIT BOARD WITH LOW CROSS-TALK NOISE
17
Patent #:
7209368
Issue Dt:
04/24/2007
Application #:
10790747
Filing Dt:
03/03/2004
Publication #:
US20050195585
Pub Dt:
09/08/2005
Title:
CIRCUITIZED SUBSTRATE WITH SIGNAL WIRE SHIELDING, ELECTRICAL ASSEMBLY UTILIZING SAME AND METHOD OF MAKING
18
Patent #:
7152319
Issue Dt:
12/26/2006
Application #:
10811817
Filing Dt:
03/30/2004
Publication #:
US20040231888
Pub Dt:
11/25/2004
Title:
METHOD OF MAKING HIGH SPEED CIRCUIT BOARD
19
Patent #:
7047630
Issue Dt:
05/23/2006
Application #:
10811915
Filing Dt:
03/30/2004
Publication #:
US20040177998
Pub Dt:
09/16/2004
Title:
METHOD OF MAKING CIRCUITIZED SUBSTRATE ASSEMBLY
20
Patent #:
7270845
Issue Dt:
09/18/2007
Application #:
10812889
Filing Dt:
03/31/2004
Publication #:
US20050224767
Pub Dt:
10/13/2005
Title:
DIELECTRIC COMPOSITION FOR FORMING DIELECTRIC LAYER FOR USE IN CIRCUITIZED SUBSTRATES
21
Patent #:
7078816
Issue Dt:
07/18/2006
Application #:
10812890
Filing Dt:
03/31/2004
Publication #:
US20050224985
Pub Dt:
10/13/2005
Title:
CIRCUITIZED SUBSTRATE
22
Patent #:
7142121
Issue Dt:
11/28/2006
Application #:
10860071
Filing Dt:
06/04/2004
Publication #:
US20050270160
Pub Dt:
12/08/2005
Title:
RADIO FREQUENCY DEVICE FOR TRACKING GOODS
23
Patent #:
7157646
Issue Dt:
01/02/2007
Application #:
10882167
Filing Dt:
07/02/2004
Publication #:
US20060000636
Pub Dt:
01/05/2006
Title:
CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
24
Patent #:
7157647
Issue Dt:
01/02/2007
Application #:
10882170
Filing Dt:
07/02/2004
Publication #:
US20060000639
Pub Dt:
01/05/2006
Title:
CIRCUITIZED SUBSTRATE WITH FILLED ISOLATION BORDER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
25
Patent #:
7253502
Issue Dt:
08/07/2007
Application #:
10900385
Filing Dt:
07/28/2004
Publication #:
US20060022303
Pub Dt:
02/02/2006
Title:
CIRCUITIZED SUBSTRATE WITH INTERNAL ORGANIC MEMORY DEVICE, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
26
Patent #:
7045897
Issue Dt:
05/16/2006
Application #:
10900386
Filing Dt:
07/28/2004
Publication #:
US20060022310
Pub Dt:
02/02/2006
Title:
ELECTRICAL ASSEMBLY WITH INTERNAL MEMORY CIRCUITIZED SUBSTRATE HAVING ELECTRONIC COMPONENTS POSITIONED THEREON, METHOD OF MAKING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
27
Patent #:
7071423
Issue Dt:
07/04/2006
Application #:
10915483
Filing Dt:
08/11/2004
Publication #:
US20050011670
Pub Dt:
01/20/2005
Title:
CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
28
Patent #:
7145221
Issue Dt:
12/05/2006
Application #:
10920235
Filing Dt:
08/18/2004
Publication #:
US20050224251
Pub Dt:
10/13/2005
Title:
LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
29
Patent #:
6900392
Issue Dt:
05/31/2005
Application #:
10933260
Filing Dt:
09/03/2004
Publication #:
US20050023035
Pub Dt:
02/03/2005
Title:
INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
30
Patent #:
7294791
Issue Dt:
11/13/2007
Application #:
10953923
Filing Dt:
09/29/2004
Publication #:
US20060065433
Pub Dt:
03/30/2006
Title:
CIRCUITIZED SUBSTRATE WITH IMPROVED IMPEDANCE CONTOL CIRCUITRY, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
31
Patent #:
6995322
Issue Dt:
02/07/2006
Application #:
10955741
Filing Dt:
09/30/2004
Publication #:
US20050039950
Pub Dt:
02/24/2005
Title:
HIGH SPEED CIRCUITIZED SUBSTRATE WITH REDUCED THRU-HOLE STUB, METHOD FOR FABRICATION AND INFORMATION HANDLING SYSTEM UTILIZING SAME
32
Patent #:
7087441
Issue Dt:
08/08/2006
Application #:
10968929
Filing Dt:
10/21/2004
Publication #:
US20060099727
Pub Dt:
05/11/2006
Title:
METHOD OF MAKING A CIRCUITIZED SUBSTRATE HAVING A PLURALITY OF SOLDER CONNECTION SITES THEREON
33
Patent #:
6964884
Issue Dt:
11/15/2005
Application #:
10991451
Filing Dt:
11/19/2004
Title:
CIRCUITIZED SUBSTRATES UTILIZING THREE SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF, METHOD OF MAKING SAME, AND ELECTRICAL ASSEMBLIES AND INFORMATION HANDLING SYSTEMS UTILIZING SAME
34
Patent #:
7383629
Issue Dt:
06/10/2008
Application #:
10991532
Filing Dt:
11/19/2004
Publication #:
US20060110898
Pub Dt:
05/25/2006
Title:
METHOD OF MAKING CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF
35
Patent #:
7025607
Issue Dt:
04/11/2006
Application #:
11031074
Filing Dt:
01/10/2005
Title:
CAPACITOR MATERIAL WITH METAL COMPONENT FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
Assignor
1
WACHOVIA CAPITAL FINANCE CORPORATION
Exec Dt:
09/30/2008
Assignee
1
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET
ENDICOTT, NEW YORK 13760
Correspondence name and address
MARK LEVY
HINMAN, HOWARD & KATTELL, LLP
700 SECURITY MUTUAL BLDG.
80 EXCHANGE STREET
BINGHAMTON, NEW YORK 13902

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