Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021888/0088 | |
| Pages: | 5 |
| | Recorded: | 11/25/2008 | | |
| Attorney Dkt #: | MAT-44577 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/11/2011
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Application #:
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12302376
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Filing Dt:
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11/25/2008
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Publication #:
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Pub Dt:
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08/13/2009
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Title:
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RESIN SEALING SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING RESIN SEALING SEMICONDUCTOR DEVICE
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Assignee
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| 3744 OHKA |
| NUMAZU-SHI, SHIZUOKA, JAPAN 410-0022 |
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Correspondence name and address
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PEARNE & GORDON LLP
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1801 EAST 9TH STREET
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SUITE 1200
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CLEVELAND, OH 44114-3108
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