Patent Assignment Details
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Reel/Frame: | 021905/0974 | |
| Pages: | 2 |
| | Recorded: | 12/01/2008 | | |
Attorney Dkt #: | 8053-1040-1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/22/2010
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Application #:
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12325670
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Filing Dt:
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12/01/2008
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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METHOD OF FORMING A SEMICONDUCTOR DEVICE FEATURING COPPER WIRING LAYERS OF DIFFERENT WIDTHS HAVING METAL CAPPING LAYERS OF DIFFERENT THICKNESSES FORMED THEREON
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Assignee
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1753 SHIMONUMABE |
NAKAHARA-KU, KAWASAKI |
KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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YOUNG & THOMPSON
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209 MADISON STREET
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SUITE 500
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ALEXANDRIA, VA 22314
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