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Patent Assignment Details
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Reel/Frame:021910/0934   Pages: 2
Recorded: 11/24/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12231752
Filing Dt:
09/05/2008
Publication #:
Pub Dt:
03/19/2009
Title:
Apparatus and method for picking-up semiconductor dies
Assignors
1
Exec Dt:
10/23/2008
2
Exec Dt:
10/23/2008
3
Exec Dt:
10/24/2008
4
Exec Dt:
10/24/2008
Assignee
1
2-51-1, INADAIRA
MASASHIMURAYAMA-SHI, TOKYO, JAPAN
Correspondence name and address
WILLIAM L. ANDROLIA
QUINN EMANUEL URQUHART OLIVER
& HEDGES, KODA/ANDROLIA
865 SOUTH FIGUEROA STREET, 10TH FLOOR
LOS ANGELES, CALIFORNIA 90017

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