Patent Assignment Details
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| Reel/Frame: | 021913/0107 | |
| Pages: | 7 |
| | Recorded: | 12/02/2008 | | |
| Attorney Dkt #: | MA105-022 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12131777
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Filing Dt:
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06/02/2008
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Publication #:
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Pub Dt:
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12/03/2009
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Title:
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BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING
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Assignee
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| 3RD FLOOR, BIO-INFORMATICS CENTRE |
| 2 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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JAMES D. SHAURETTE
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WELLS ST. JOHN, P.S.
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601 W. 1ST AVE., #1300
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SPOKANE, WA 99201
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