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Patent Assignment Details
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Reel/Frame:021915/0887   Pages: 4
Recorded: 11/25/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/06/2011
Application #:
12232429
Filing Dt:
09/17/2008
Publication #:
Pub Dt:
03/19/2009
Title:
INTEGRAL SKIN MOLDED ARTICLE AND METHOD OF PREPARING INTEGRAL SKIN MOLDED ARTICLE AND LAMINATE HAVING SKIN
Assignors
1
Exec Dt:
09/04/2008
2
Exec Dt:
09/04/2008
3
Exec Dt:
09/03/2008
4
Exec Dt:
10/14/2008
5
Exec Dt:
10/17/2008
Assignees
1
4-9, UMEDA 2-CHOME, KITA-KU
OSAKA-SHI, OSAKA 530-0001, JAPAN
2
218, AOSHIMA-CHO, FUJI-SHI
SHIZUOKA 417-0047, JAPAN
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: WARREN M. CHEEK, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, D.C. 20006-1021

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