Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021924/0182 | |
| Pages: | 17 |
| | Recorded: | 12/04/2008 | | |
| Attorney Dkt #: | 204311-10001 |
| Conveyance: | INTELLECTUAL PROPERTY SECURITY AGREEMENT |
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Total properties:
3
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Patent #:
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Issue Dt:
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10/04/1994
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Application #:
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08052518
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Filing Dt:
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04/29/1993
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Title:
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LEAD-FREE BISMUTH FREE TIN ALLOY SOLDER COMPOSITION
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Patent #:
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Issue Dt:
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04/11/1995
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Application #:
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08225826
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Filing Dt:
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04/11/1994
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Title:
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LEAD-FREE AND BISMUTH-FREE TIN ALLOY SOLDER COMPOSITION
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11432299
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Filing Dt:
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05/11/2006
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Publication #:
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Pub Dt:
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11/23/2006
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Title:
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Tin alloy solder compositions
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Assignee
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| ROYAL TRUST TOWER |
| 77 KING STREET WEST, 18TH FLOOR |
| TORONTO, ONTARIO, CANADA M5K 1A2 |
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Correspondence name and address
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KEVIN M. EISENBERG/LOEB & LOEB LLP
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345 PARK AVENUE
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NEW YORK, NY 10154
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