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Reel/Frame:021970/0261   Pages: 4
Recorded: 12/12/2008
Attorney Dkt #:APPM/8241 D1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12332882
Filing Dt:
12/11/2008
Publication #:
Pub Dt:
05/14/2009
Title:
MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS
Assignors
1
Exec Dt:
07/08/2003
2
Exec Dt:
07/07/2003
3
Exec Dt:
07/01/2003
4
Exec Dt:
07/01/2003
Assignee
1
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95052
Correspondence name and address
KEITH TABOADA, ESQ.
595 SHREWSBURY AVENUE
SUITE 100
SHREWSBURY, NJ 07702

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