Patent Assignment Details
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| Reel/Frame: | 022024/0452 | |
| Pages: | 3 |
| | Recorded: | 12/19/2008 | | |
| Attorney Dkt #: | 52433/544 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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09254118
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Filing Dt:
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05/19/1999
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Publication #:
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Pub Dt:
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08/09/2001
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Title:
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METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES
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Assignee
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| 4-14-1, SOTOKANDA, CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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Correspondence name and address
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JOHN J. KELLY, JR.
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KENYON & KENYON LLP
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ONE BROADWAY
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NEW YORK, NEW YORK 10004
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