Patent Assignment Details
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Reel/Frame: | 022061/0744 | |
| Pages: | 3 |
| | Recorded: | 12/31/2008 | | |
Attorney Dkt #: | 2008_2190A |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12308984
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Filing Dt:
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12/31/2008
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Publication #:
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Pub Dt:
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11/26/2009
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Title:
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Mold Assembly
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Assignee
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1-1, KYOBASHI 1-CHOME, CHUO-KU, |
TOKYO 104-0031, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: MICHAEL S. HUPPERT, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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