Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 022086/0001 | |
| Pages: | 37 |
| | Recorded: | 01/09/2009 | | |
Attorney Dkt #: | 101732-0000 |
Conveyance: | LEGAL DOCUMENTS LISTED ON APPENDIX A |
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Total properties:
7
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Patent #:
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Issue Dt:
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12/02/2008
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Application #:
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10725933
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Filing Dt:
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12/03/2003
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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12/02/2008
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Application #:
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10725933
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Filing Dt:
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12/03/2003
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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08/28/2007
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Application #:
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11169722
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Filing Dt:
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06/30/2005
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Publication #:
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Pub Dt:
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10/27/2005
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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08/28/2007
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Application #:
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11169722
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Filing Dt:
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06/30/2005
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Publication #:
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Pub Dt:
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10/27/2005
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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11301303
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Filing Dt:
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12/12/2005
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Publication #:
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Pub Dt:
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05/04/2006
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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11301303
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Filing Dt:
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12/12/2005
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Publication #:
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Pub Dt:
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05/04/2006
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11595970
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Filing Dt:
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11/13/2006
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Publication #:
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Pub Dt:
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03/15/2007
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Title:
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Fan out type wafer level package structure and method of the same
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Assignee
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NO. 65, KUANG-FU NORTH RD. |
HSINCHU-CHU INDUSTRIAL PARK |
HU-KOU, HSIN-CHU COUNTY, TAIWAN 303 |
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Correspondence name and address
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JERE VALLES/MORGAN, LEWIS & BOCKIUS LLP
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ONE MARKET, SPEAR STREET TOWER
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SAN FRANCISCO, CA 94105
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