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Total properties:
12
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Patent #:
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Issue Dt:
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09/20/1994
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Application #:
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07592709
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Filing Dt:
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10/04/1990
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Title:
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SYSTEM FOR SECURING AND ELECTRICALLY CONNECTING A SEMICONDUCTOR CHIP TO A SUBSTRATE
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Patent #:
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Issue Dt:
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12/22/1992
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Application #:
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07718524
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Filing Dt:
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06/21/1991
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Title:
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METHOD OF PROVIDING POWER TO AN INTERGRATED CIRCUIT
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Patent #:
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Issue Dt:
|
09/20/1994
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Application #:
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07854486
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Filing Dt:
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03/20/1992
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Title:
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INTEGRATED CIRCUIT PACKAGE INCLUDING A HEAT PIPE
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Patent #:
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Issue Dt:
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12/06/1994
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Application #:
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07918816
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Filing Dt:
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07/22/1992
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Title:
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PACKAGE STRUCTURE AND METHOD FOR REDUCING BOND WIRE INDUCTANCE
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Patent #:
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Issue Dt:
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05/30/1995
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Application #:
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08102638
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Filing Dt:
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08/05/1993
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Title:
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THIN CAVITY DOWN BALL GRID ARRAY PACKAGE BASED ON WIREBOND TECHNOLOGY
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Patent #:
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Issue Dt:
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12/06/1994
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Application #:
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08126250
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Filing Dt:
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09/24/1993
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Title:
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HIGH PERFORMANCE PACKAGE USING HIGH DIELECTRIC CONSTANT MATERIALS FOR POWER/GROUND AND LOW DIELECTRIC CONSTANT MATERIALS FOR SIGNAL LINES
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08126288
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Filing Dt:
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09/24/1993
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Title:
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SEMI-CONDUCTOR DEVICE INTERCONNECT PACKAGE ASSEMBLY FOR IMPROVED PACKAGE PERFORMANCE
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Patent #:
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Issue Dt:
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09/07/1999
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Application #:
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09054937
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Filing Dt:
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04/03/1998
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Title:
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PRODUCTION AND TEST SOCKET FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09290154
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Filing Dt:
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04/12/1999
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Title:
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HIGH PERFORMANCE FLIP-CHIP SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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03/06/2001
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Application #:
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09313685
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Filing Dt:
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05/18/1999
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Title:
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INTERCONNECT LAYOUT PATTERN FOR INTEGRATED CIRCUIT PACKAGES AND THE LIKE
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Patent #:
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Issue Dt:
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10/07/2003
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Application #:
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09405375
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Filing Dt:
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09/24/1999
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Publication #:
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Pub Dt:
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08/23/2001
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Title:
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INTEGRATED CIRCUIT PACKAGE AND BALL-GRID ARRAY INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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04/30/2002
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Application #:
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09439564
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Filing Dt:
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11/12/1999
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Title:
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FLEXIBLE PIN COUNT PACKAGE FOR SEMICONDUCTOR DEVICE
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