Patent Assignment Details
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| Reel/Frame: | 022096/0623 | |
| Pages: | 3 |
| | Recorded: | 01/07/2009 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/22/2011
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Application #:
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12309110
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Filing Dt:
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01/07/2009
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Publication #:
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Pub Dt:
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11/05/2009
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Title:
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CONNECTING STRUCTURE FOR FLIP-CHIP SEMICONDUCTOR PACKAGE, BUILD-UP LAYER MATERIAL, SEALING RESIN COMPOSITION, AND CIRCUIT BOARD
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Assignee
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN |
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Correspondence name and address
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MICHAEL A. MAKUCH
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SMITH, GAMBRELL & RUSSELL, LLP
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1130 CONNECTICUT AVENUE - SUITE 1130
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WASHINGTON, DC 20036
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