Patent Assignment Details
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Reel/Frame: | 022118/0200 | |
| Pages: | 2 |
| | Recorded: | 01/06/2009 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12319316
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Filing Dt:
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01/06/2009
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Publication #:
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Pub Dt:
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07/09/2009
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Title:
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Microphone package, lead frame, mold substrate, and mounting structure therefor
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Assignee
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10-1, NAKAZAWA-CHO, NAKA-KU, |
HAMAMATSU-SHI |
SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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PILLSBURY WINTHROP SHAW PITTMAN LLP
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725 SOUTH FIGUEROA STREET
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SUITE 2800
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LOS ANGELES, CA 90017-5406
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