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Total properties:
11
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08376799
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Filing Dt:
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01/23/1995
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Title:
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STACKABLE MODULES AND MULTIMODULAR ASSEMBLIES
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Patent #:
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Issue Dt:
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06/03/1997
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Application #:
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08421848
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Filing Dt:
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04/14/1995
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Title:
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DRY ADHESIVE JOINING OF LAYERS OF ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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09/14/1999
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Application #:
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08777747
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Filing Dt:
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12/21/1996
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Title:
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STACKABLE LAYERS CONTAINING ENCAPSULATED IC CHIPS
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09223476
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Filing Dt:
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12/30/1998
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Publication #:
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Pub Dt:
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05/16/2002
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Title:
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NEURAL PROCESSING MODULE WITH INPUT ARCHITECTURES THAT MAKE MAXIMAL USE OF A WEIGHTED SYNAPSE ARRAY
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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09282704
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Filing Dt:
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03/31/1999
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Title:
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STACKABLE LAYERS CONTAINING ENCAPSULATED CHIPS
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09604782
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Filing Dt:
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06/26/2000
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Title:
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MULTI-AXIS MICRO GYRO STRUCTURE
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Patent #:
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Issue Dt:
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11/05/2002
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Application #:
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09853819
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Filing Dt:
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05/11/2001
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Publication #:
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Pub Dt:
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11/14/2002
| | | | |
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Title:
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METHOD AND APPARATUS FOR TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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09921525
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Filing Dt:
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08/03/2001
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Publication #:
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Pub Dt:
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02/06/2003
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Title:
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RETRO-REFLECTOR WARM STOP FOR UNCOOLED THERMAL IMAGING CAMERAS AND METHOD OF USING THE SAME
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Patent #:
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Issue Dt:
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05/06/2003
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Application #:
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09949024
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Filing Dt:
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09/07/2001
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Publication #:
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Pub Dt:
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03/13/2003
| | | | |
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Title:
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STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER
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Patent #:
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Issue Dt:
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02/14/2006
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Application #:
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10701783
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Filing Dt:
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11/05/2003
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Publication #:
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Pub Dt:
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07/22/2004
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Title:
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METHOD FOR CREATING NEO-WAFERS FROM SINGULATED INTEGRATED CIRCUIT DIE AND A DEVICE MADE ACCORDING TO THE METHOD
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Patent #:
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Issue Dt:
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02/07/2006
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Application #:
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10726888
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Filing Dt:
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12/04/2003
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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METHOD FOR ELECTRICAL INTERCONNECTION OF ANGULARLY DISPOSED CONDUCTIVE PATTERNS
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