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Patent Assignment Details
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Reel/Frame:022137/0609   Pages: 10
Recorded: 01/21/2009
Conveyance: CORRECTION TO THE SECURITY INTEREST RELEASE EXECUTION DATE AND TYPOGRAPHICAL ERROR WHICH DESCRIBED THIS RELEASE AS A SECURITY AGREEMENT RATHER THAN AS A RELEASE OF SECURITY AGREEMENT AT REEL/FRAME 021861/0531 AND RECORDED ON 11/19/2008.
Total properties: 69
1
Patent #:
4304624
Issue Dt:
12/08/1981
Application #:
05855242
Filing Dt:
11/28/1977
Title:
METHOD OF FABRICATION A MULTI-LAYER STRUCTUE FOR DETECTOR ARRAY MODULE
2
Patent #:
4352715
Issue Dt:
10/05/1982
Application #:
06206993
Filing Dt:
11/17/1980
Title:
DETECTOR ARRAY MODULE FABRICATION
3
Patent #:
4354107
Issue Dt:
10/12/1982
Application #:
06206994
Filing Dt:
11/14/1980
Title:
DETECTOR ARRAY MODULE - STRUCTURE AND FABRICATION
4
Patent #:
4403238
Issue Dt:
09/06/1983
Application #:
06213933
Filing Dt:
12/08/1980
Title:
DETECTOR ARRAY FOCAL PLANE CONFIGURATION
5
Patent #:
4490626
Issue Dt:
12/25/1984
Application #:
06403004
Filing Dt:
07/29/1982
Title:
MULTIPLEXER CIRCUITRY FOR HIGH DENSITY ANALOG SIGNALS
6
Patent #:
4525921
Issue Dt:
07/02/1985
Application #:
06517221
Filing Dt:
07/25/1983
Title:
HIGH-DENSITY ELECTRONIC PROCESSING PACKAGE-STRUCTURE AND FABRICATION
7
Patent #:
4555623
Issue Dt:
11/26/1985
Application #:
06558099
Filing Dt:
12/05/1983
Title:
PRE-AMPLIFIER IN FOCAL PLANE DETECTOR ARRAY
8
Patent #:
4551629
Issue Dt:
11/05/1985
Application #:
06572802
Filing Dt:
01/23/1984
Title:
DETECTOR ARRAY MODULE-STRUCTURE AND FABRICATION
9
Patent #:
4596948
Issue Dt:
06/24/1986
Application #:
06661727
Filing Dt:
10/17/1984
Title:
CONSTANT CURRENT SOURCE FOR INTEGRATED CIRCUITS
10
Patent #:
4617160
Issue Dt:
10/14/1986
Application #:
06674096
Filing Dt:
11/23/1984
Title:
METHOD FOR FABRICATING MODULES COMPRISING UNIFORMLY STACKED,ALIGNED CIRCUIT-CARRYING LAYERS
11
Patent #:
4646128
Issue Dt:
02/24/1987
Application #:
06720902
Filing Dt:
04/08/1985
Title:
HIGH-DENSITY ELECTRONIC PROCESSING PACKAGE - STRUCTURE AND FABRICATION
12
Patent #:
4672737
Issue Dt:
06/16/1987
Application #:
06761889
Filing Dt:
08/02/1985
Title:
DETECTOR ARRAY MODULE FABRICATION PROCESS
13
Patent #:
4675532
Issue Dt:
06/23/1987
Application #:
06795988
Filing Dt:
11/06/1985
Title:
COMBINED STARING AND SCANNING PHOTODETECTOR SENSING SYSTEM HAVING BOTH TEMPORAL AND SPATIAL FILTERING
14
Patent #:
4704319
Issue Dt:
11/03/1987
Application #:
06842159
Filing Dt:
03/21/1986
Title:
APPARATUS AND METHOD FOR FABRICATING MODULES COMPRISING STACKED CIRCUIT-CARRYING LAYERS
15
Patent #:
4706166
Issue Dt:
11/10/1987
Application #:
06856835
Filing Dt:
04/25/1986
Title:
HIGH-DENSITY ELECTRONIC MODULES - PROCESS & PRODUCT
16
Patent #:
4764846
Issue Dt:
08/16/1988
Application #:
07000562
Filing Dt:
01/05/1987
Title:
HIGH DENSITY ELECTRONIC PACKAGE COMPRISING STACKED SUB-MODULES
17
Patent #:
4806761
Issue Dt:
02/21/1989
Application #:
07023644
Filing Dt:
03/09/1987
Title:
THERMAL IMAGER INCORPORATING ELECTRONICS MODULE HAVING FOCAL PLANE SENSOR MOSAIC
18
Patent #:
4791286
Issue Dt:
12/13/1988
Application #:
07042686
Filing Dt:
04/27/1987
Title:
PRE-AMPLIFIER IN FOCAL PLANE DETECTOR ARRAY
19
Patent #:
4779005
Issue Dt:
10/18/1988
Application #:
07048551
Filing Dt:
05/11/1987
Title:
MULTIPLE DETECTOR VIEWING OF PIXELS USING PARALLEL TIME DELAY AND INTEGRATION CIRCUITRY
20
Patent #:
4912545
Issue Dt:
03/27/1990
Application #:
07097797
Filing Dt:
09/16/1987
Title:
BONDING OF ALIGNED CONDUCTIVE BUMPS ON ADJACENT SURFACES
21
Patent #:
4814629
Issue Dt:
03/21/1989
Application #:
07107352
Filing Dt:
10/13/1987
Title:
PIXEL DISPLACEMENT BY SERIES- PARALLEL ANALOG SWITCHING
22
Patent #:
4983533
Issue Dt:
01/08/1991
Application #:
07114415
Filing Dt:
10/28/1987
Title:
HIGH-DENSITY ELECTRONIC MODULES - PROCESS & PRODUCT
23
Patent #:
5045685
Issue Dt:
09/03/1991
Application #:
07534969
Filing Dt:
06/06/1990
Title:
ANALOG TO DIGITAL CONVERSION ON MULTIPLE CHANNEL IC CHIPS
24
Patent #:
5235672
Issue Dt:
08/10/1993
Application #:
07651477
Filing Dt:
02/06/1991
Title:
HARDWARE FOR ELECTRONIC NEURAL NETWORK
25
Patent #:
5104820
Issue Dt:
04/14/1992
Application #:
07720025
Filing Dt:
06/24/1991
Title:
METHOD OF FABRICATING ELECTRONIC CIRCUITRY UNIT CONTAINING STACKED IC LAYERS HAVING LEAD REROUTING
26
Patent #:
5304790
Issue Dt:
04/19/1994
Application #:
07956914
Filing Dt:
10/05/1992
Title:
APPARATUS AND SYSTEM FOR CONTROLLABLY VARYING IMAGE RESOLUTION TO REDUCE DATA OUTPUT
27
Patent #:
5347428
Issue Dt:
09/13/1994
Application #:
07985837
Filing Dt:
12/03/1992
Title:
MODULE COMPRISING IC MEMORY STACK DEDICATED TO AN STRUCTURALLY COMBINED WITH AN IC MICROPROCESSOR CHIP
28
Patent #:
5279991
Issue Dt:
01/18/1994
Application #:
07996794
Filing Dt:
12/24/1992
Title:
A METHOD FOR FABRICATING STACKS OF IC CHIPS BY SEGMENTING A LARGER STACK
29
Patent #:
5406701
Issue Dt:
04/18/1995
Application #:
08120675
Filing Dt:
09/13/1993
Title:
FABRICATION OF DENSE PARALLEL SOLDER BUMP CONNECTIONS
30
Patent #:
5432318
Issue Dt:
07/11/1995
Application #:
08178923
Filing Dt:
01/07/1994
Title:
APPARATUS FOR SEGMENTING STACKED IC CHIPS
31
Patent #:
5424920
Issue Dt:
06/13/1995
Application #:
08232739
Filing Dt:
04/25/1994
Title:
NON-CONDUCTIVE END LAYER FOR INTEGRATED STACK OF IC CHIPS
32
Patent #:
5432729
Issue Dt:
07/11/1995
Application #:
08255465
Filing Dt:
06/08/1994
Title:
ELECTRONIC MODULE COMPRISING A STACK OF IC CHIPS EACH INTERACTING WITH AN IC CHIP SECURED TO THE STACK
33
Patent #:
5508836
Issue Dt:
04/16/1996
Application #:
08305066
Filing Dt:
09/13/1994
Title:
INFRARED WIRELESS COMMUNICATION BETWEEN ELECTRONIC SYSTEM COMPONENTS
34
Patent #:
5581498
Issue Dt:
12/03/1996
Application #:
08326645
Filing Dt:
10/20/1994
Title:
STACK OF IC CHIPS IN LIEU OF SINGLE IC CHIP
35
Patent #:
5701233
Issue Dt:
12/23/1997
Application #:
08376799
Filing Dt:
01/23/1995
Title:
STACKABLE MODULES AND MULTIMODULAR ASSEMBLIES
36
Patent #:
5635705
Issue Dt:
06/03/1997
Application #:
08526415
Filing Dt:
09/11/1995
Title:
SENSING AND SELECTING OBSERVED EVENTS FOR SIGNAL PROCESSING
37
Patent #:
5745631
Issue Dt:
04/28/1998
Application #:
08592691
Filing Dt:
01/26/1996
Title:
SELF-ALIGNING OPTICAL BEAM SYSTEM
38
Patent #:
5688721
Issue Dt:
11/18/1997
Application #:
08622671
Filing Dt:
03/26/1996
Title:
3D STACK OF IC CHIPS HAVING LEADS REACHED BY VIAS THROUGH PASSIVATION COVERING ACCESS PLANE
39
Patent #:
5953588
Issue Dt:
09/14/1999
Application #:
08777747
Filing Dt:
12/21/1996
Title:
STACKABLE LAYERS CONTAINING ENCAPSULATED IC CHIPS
40
Patent #:
6195268
Issue Dt:
02/27/2001
Application #:
09031435
Filing Dt:
02/26/1998
Title:
STACKING LAYERS CONTAINING ENCLOSED IC CHIPS
41
Patent #:
6028352
Issue Dt:
02/22/2000
Application #:
09095415
Filing Dt:
06/10/1998
Title:
IC STACK UTILIZING SECONDARY LEADFRAMES
42
Patent #:
6014316
Issue Dt:
01/11/2000
Application #:
09095416
Filing Dt:
06/10/1998
Title:
IC STACK UTILIZING BGA CONTACTS
43
Patent #:
5955668
Issue Dt:
09/21/1999
Application #:
09166458
Filing Dt:
10/05/1998
Title:
MULTI- ELEMENT MICRO GYRO
44
Patent #:
6389404
Issue Dt:
05/14/2002
Application #:
09223476
Filing Dt:
12/30/1998
Publication #:
US20020059152
Pub Dt:
05/16/2002
Title:
NEURAL PROCESSING MODULE WITH INPUT ARCHITECTURES THAT MAKE MAXIMAL USE OF A WEIGHTED SYNAPSE ARRAY
45
Patent #:
6117704
Issue Dt:
09/12/2000
Application #:
09282704
Filing Dt:
03/31/1999
Title:
STACKABLE LAYERS CONTAINING ENCAPSULATED CHIPS
46
Patent #:
6089089
Issue Dt:
07/18/2000
Application #:
09301847
Filing Dt:
04/29/1999
Title:
MULTI-ELEMENT MICRO GYRO
47
Patent #:
6072234
Issue Dt:
06/06/2000
Application #:
09316740
Filing Dt:
05/21/1999
Title:
STACK OF EQUAL LAYER NEO-CHIPS CONTAINING ENCAPSULATED IC CHIPS OF DIFFERENT SIZES
48
Patent #:
6650704
Issue Dt:
11/18/2003
Application #:
09427384
Filing Dt:
10/25/1999
Title:
METHOD OF PRDUCING A HIGH QUALITY, HIGH RESOLUTION IMAGE FROM A SEQUENCE OF LOW QUALITY, LOW RESOLUTION IMAGES THAT ARE UNDERSAMPLED AND SUBJECT TO JITTER
49
Patent #:
6578420
Issue Dt:
06/17/2003
Application #:
09604782
Filing Dt:
06/26/2000
Title:
MULTI-AXIS MICRO GYRO STRUCTURE
50
Patent #:
6476392
Issue Dt:
11/05/2002
Application #:
09853819
Filing Dt:
05/11/2001
Publication #:
US20020166967
Pub Dt:
11/14/2002
Title:
METHOD AND APPARATUS FOR TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY
51
Patent #:
6596997
Issue Dt:
07/22/2003
Application #:
09921525
Filing Dt:
08/03/2001
Publication #:
US20030025083
Pub Dt:
02/06/2003
Title:
RETRO-REFLECTOR WARM STOP FOR UNCOOLED THERMAL IMAGING CAMERAS AND METHOD OF USING THE SAME
52
Patent #:
6797537
Issue Dt:
09/28/2004
Application #:
09938686
Filing Dt:
10/30/2001
Publication #:
US20030080419
Pub Dt:
05/01/2003
Title:
METHOD OF MAKING STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLAYING INTERCONNECT LAYERS
53
Patent #:
6734370
Issue Dt:
05/11/2004
Application #:
09948950
Filing Dt:
09/07/2001
Publication #:
US20030047353
Pub Dt:
03/13/2003
Title:
MULTILAYER MODULES WITH FLEXIBLE SUBSTRATES
54
Patent #:
6560109
Issue Dt:
05/06/2003
Application #:
09949024
Filing Dt:
09/07/2001
Publication #:
US20030048609
Pub Dt:
03/13/2003
Title:
STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER
55
Patent #:
6717061
Issue Dt:
04/06/2004
Application #:
09949512
Filing Dt:
09/07/2001
Publication #:
US20030049424
Pub Dt:
03/13/2003
Title:
STACKING OF MULTILAYER MODULES
56
Patent #:
6829237
Issue Dt:
12/07/2004
Application #:
09973857
Filing Dt:
10/09/2001
Publication #:
US20020159449
Pub Dt:
10/31/2002
Title:
HIGH SPEED MULTI-STAGE SWITCHING NETWORK FORMED FROM STACKED SWITCHING LAYERS
57
Patent #:
6806559
Issue Dt:
10/19/2004
Application #:
10128728
Filing Dt:
04/22/2002
Publication #:
US20030197253
Pub Dt:
10/23/2003
Title:
METHOD AND APPARATUS FOR CONNECTING VERTICALLY STACKED INTEGRATED CIRCUIT CHIPS
58
Patent #:
6706971
Issue Dt:
03/16/2004
Application #:
10142557
Filing Dt:
05/10/2002
Publication #:
US20020126459
Pub Dt:
09/12/2002
Title:
STACKABLE MICROCIRCUIT LAYER FORMED FROM A PLASTIC ENCAPSULATED MICROCIRCUIT AND METHOD OF MAKING THE SAME
59
Patent #:
NONE
Issue Dt:
Application #:
10197006
Filing Dt:
07/16/2002
Publication #:
US20020180605
Pub Dt:
12/05/2002
Title:
Wearable biomonitor with flexible thinned integrated circuit
60
Patent #:
6891160
Issue Dt:
05/10/2005
Application #:
10281393
Filing Dt:
10/25/2002
Publication #:
US20030122077
Pub Dt:
07/03/2003
Title:
METHOD AND APPARATUS FOR TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY
61
Patent #:
6784547
Issue Dt:
08/31/2004
Application #:
10302680
Filing Dt:
11/21/2002
Publication #:
US20030127735
Pub Dt:
07/10/2003
Title:
STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME
62
Patent #:
7082591
Issue Dt:
07/25/2006
Application #:
10346363
Filing Dt:
01/17/2003
Publication #:
US20040040005
Pub Dt:
02/26/2004
Title:
METHOD FOR EFFECTIVELY EMBEDDING VARIOUS INTEGRATED CIRCUITS WITHIN FIELD PROGRAMMABLE GATE ARRAYS
63
Patent #:
6856167
Issue Dt:
02/15/2005
Application #:
10347038
Filing Dt:
01/17/2003
Publication #:
US20030223295
Pub Dt:
12/04/2003
Title:
FIELD PROGRAMMABLE GATE ARRAY WITH A VARIABLY WIDE WORD WIDTH MEMORY
64
Patent #:
6967411
Issue Dt:
11/22/2005
Application #:
10360244
Filing Dt:
02/07/2003
Publication #:
US20040004286
Pub Dt:
01/08/2004
Title:
STACKABLE LAYERS CONTAINING BALL GRID ARRAY PACKAGES
65
Patent #:
6912862
Issue Dt:
07/05/2005
Application #:
10615641
Filing Dt:
07/08/2003
Publication #:
US20040007004
Pub Dt:
01/15/2004
Title:
CRYOPUMP PISTON POSITION TRACKING
66
Patent #:
NONE
Issue Dt:
Application #:
10663371
Filing Dt:
09/16/2003
Publication #:
US20040113222
Pub Dt:
06/17/2004
Title:
Stacked microelectronic module with vertical interconnect vias
67
Patent #:
7417323
Issue Dt:
08/26/2008
Application #:
10703177
Filing Dt:
11/06/2003
Publication #:
US20040147064
Pub Dt:
07/29/2004
Title:
NEO-WAFER DEVICE AND METHOD
68
Patent #:
NONE
Issue Dt:
Application #:
10805849
Filing Dt:
03/22/2004
Publication #:
US20040188596
Pub Dt:
09/30/2004
Title:
Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits
69
Patent #:
NONE
Issue Dt:
Application #:
11003429
Filing Dt:
12/06/2004
Publication #:
US20050096513
Pub Dt:
05/05/2005
Title:
Wearable biomonitor with flexible thinned integrated circuit
Assignor
1
SQUARE 1 BANK
Exec Dt:
12/29/2006
Assignee
1
IRVINE SENSORS CORPORATION
3001 REDHILL AVE., BUILDING 4, SUITE 108
COSTA MESA, CALIFORNIA USA 92626
Correspondence name and address
W. ERIC BOYD
IRVINE SENSORS CORP.
3001 REDHILL AVE., BUILDING 4, SUITE 108
COSTA MESA, CA 92626

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