Patent Assignment Details
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| Reel/Frame: | 022150/0639 | |
| Pages: | 4 |
| | Recorded: | 01/23/2009 | | |
| Attorney Dkt #: | NSC1P415D1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12358143
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Filing Dt:
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01/22/2009
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Publication #:
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Pub Dt:
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06/17/2010
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Title:
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WAFER LEVEL METHOD OF FORMING SIDE FIBER INSERTION OPTOELECTRONIC PACKAGES
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Assignee
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER LAW GROUP LLP
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P.O. BOX 1687
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CUPERTINO, CA 95015-1687
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