Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 022192/0133 | |
| Pages: | 8 |
| | Recorded: | 02/02/2009 | | |
| Attorney Dkt #: | 12641/US/FEG/SYNX/CROCKER |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12249812
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Filing Dt:
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10/10/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Title:
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THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR
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Assignee
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| P.O. BOX 450A |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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APPLIED MATERIALS
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P.O. BOX 450A
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SANTA CLARA, CA 95052
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