Patent Assignment Details
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| Reel/Frame: | 022223/0054 | |
| Pages: | 5 |
| | Recorded: | 02/08/2009 | | |
| Attorney Dkt #: | P2602US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/09/2013
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Application #:
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12304663
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Filing Dt:
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12/12/2008
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Publication #:
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Pub Dt:
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07/30/2009
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Title:
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LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF A LIGHT EMITTING DIODE PACKAGE USING THE SAME, AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD
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Assignee
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| 148-29 GASAN-DONG, GEUMCHEON-GU, GYEONGGI-DO |
| SEOUL, KOREA, REPUBLIC OF 153-801 |
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Correspondence name and address
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H.C. PARK & ASSOCIATES, PLC
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8500 LEESBURG PIKE, SUITE 7500
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VIENNA, VA 22182
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