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Patent Assignment Details
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Reel/Frame:022275/0055   Pages: 4
Recorded: 02/18/2009
Attorney Dkt #:AMDI:204\\HON
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/01/2011
Application #:
12388092
Filing Dt:
02/18/2009
Publication #:
Pub Dt:
08/19/2010
Title:
SEMICONDUCTOR CHIP WITH REINFORCEMENT LAYER AND METHOD OF MAKING THE SAME
Assignor
1
Exec Dt:
02/10/2009
Assignee
1
ONE AMD PLACE, PO BOX 3453
KEVIN A. O'NEIL
SUNNYVALE, CALIFORNIA 94088-3453
Correspondence name and address
TIMOTHY M. HONEYCUTT
PO BOX 1577
CYPRESS, TX 77410-1577

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