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Patent Assignment Details
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Reel/Frame:022326/0879   Pages: 6
Recorded: 02/27/2009
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 5
1
Patent #:
Issue Dt:
05/08/2007
Application #:
10819929
Filing Dt:
04/08/2004
Publication #:
Pub Dt:
10/14/2004
Title:
CONDUCTIVE SUBSTRATE WITH RESISTANCE LAYER, RESISTANCE BOARD, AND RESISTANCE CIRCUIT BOARD
2
Patent #:
Issue Dt:
05/29/2007
Application #:
10929471
Filing Dt:
08/31/2004
Publication #:
Pub Dt:
03/03/2005
Title:
METHOD OF PRODUCING ULTRA-THIN COPPER FOIL WITH CARRIER, ULTRA-THIN COPPER FOIL WITH CARRIER PRODUCED BY THE SAME, PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD AND CHIP ON FILM CIRCUIT BOARD
3
Patent #:
NONE
Issue Dt:
Application #:
10984896
Filing Dt:
11/10/2004
Publication #:
Pub Dt:
07/21/2005
Title:
Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
4
Patent #:
Issue Dt:
07/12/2011
Application #:
11594134
Filing Dt:
11/08/2006
Publication #:
Pub Dt:
05/17/2007
Title:
LAMINATED CIRCUIT BOARD
5
Patent #:
Issue Dt:
09/07/2010
Application #:
12205439
Filing Dt:
09/05/2008
Publication #:
Pub Dt:
01/08/2009
Title:
ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING ULTRA-THIN COPPER FOIL WITH CARRIER
Assignor
1
Exec Dt:
10/01/2008
Assignee
1
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8322
Correspondence name and address
BIRCH, STEWART, KOLASCH & BIRCH, LLP
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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