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Reel/Frame:022437/0547   Pages: 7
Recorded: 03/23/2009
Attorney Dkt #:095319-0102
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/23/2012
Application #:
12311045
Filing Dt:
03/23/2009
Publication #:
Pub Dt:
01/07/2010
Title:
NON-THERMOFUSIBLE PHENOL RESIN POWDER, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR
Assignors
1
Exec Dt:
03/16/2009
2
Exec Dt:
03/16/2009
3
Exec Dt:
03/16/2009
4
Exec Dt:
03/16/2009
5
Exec Dt:
03/16/2009
6
Exec Dt:
03/16/2009
7
Exec Dt:
03/16/2009
8
Exec Dt:
03/16/2009
Assignee
1
2, KITA 3-JO NISHI 1-CHOME, CHUO-KU
SAPPORO-SHI, HOKKAIDO 060-0003, JAPAN
Correspondence name and address
MICHAEL D. KAMINSKI
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET NW, SUITE 500
WASHINGTON, D.C. 20007-5143

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