Patent Assignment Details
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| Reel/Frame: | 022514/0344 | |
| Pages: | 3 |
| | Recorded: | 04/07/2009 | | |
| Attorney Dkt #: | 126490.00101 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11602177
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Filing Dt:
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11/21/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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Surface reforming method and surface reforming apparatus of thermoplastic resin, and molded product
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Assignee
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| 1-1-88, USHITORA, IBARAKI-SHI |
| OSAKA, JAPAN 567-8567 |
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Correspondence name and address
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MICHAEL D. WHITE
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600 NEW HAMPSHIRE AVE., N.W.
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WASHINGTON, DC 20037
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