Patent Assignment Details
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| Reel/Frame: | 022518/0794 | |
| Pages: | 8 |
| | Recorded: | 04/08/2009 | | |
| Attorney Dkt #: | 3025466 (68880US.01) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11860217
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Filing Dt:
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09/24/2007
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Publication #:
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Pub Dt:
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03/26/2009
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Title:
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BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME
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Assignee
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| 82 RUNNING HILL ROAD |
| MS 35-4E |
| SOUTH PORTLAND, MAINE 04106 |
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Correspondence name and address
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THOMAS R. FITZGERALD, ESQ.
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HISCOCK & BARCLAY, LLP
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2000 HSBC PLAZA, 100 CHESTNUT ST.
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ROCHESTER, NY 14604-2404
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