Total properties:
44
|
|
Patent #:
|
|
Issue Dt:
|
08/06/1996
|
Application #:
|
08208519
|
Filing Dt:
|
03/11/1994
|
Title:
|
APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
08208586
|
Filing Dt:
|
03/11/1994
|
Title:
|
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/30/1996
|
Application #:
|
08208691
|
Filing Dt:
|
03/11/1994
|
Title:
|
SEMICONDUCTOR CHIP CARRIER AFFORDING A HIGH-DENSITY EXTERNAL INTERFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/1996
|
Application #:
|
08237366
|
Filing Dt:
|
05/03/1994
|
Title:
|
COMPUTER WITH TWO FANS AND TWO AIR CIRCULATION AREAS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/1997
|
Application #:
|
08339705
|
Filing Dt:
|
11/14/1994
|
Title:
|
ELECTRICAL INTERCONNECT SYSTEM HAVING INSULATIVE SHROUDS FOR PREVENTING MISMATING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/1996
|
Application #:
|
08381142
|
Filing Dt:
|
01/31/1995
|
Title:
|
HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/1997
|
Application #:
|
08463703
|
Filing Dt:
|
06/05/1995
|
Title:
|
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP CARRIER AFFORDING A HIGH- DENSITY EXTERNAL INTERFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/1997
|
Application #:
|
08464384
|
Filing Dt:
|
06/05/1995
|
Title:
|
METHOD OF MANUFACTURING AN APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/1998
|
Application #:
|
08465146
|
Filing Dt:
|
06/05/1995
|
Title:
|
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/1997
|
Application #:
|
08469763
|
Filing Dt:
|
06/06/1995
|
Title:
|
HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/1998
|
Application #:
|
08476115
|
Filing Dt:
|
06/07/1995
|
Title:
|
CONTACT BEAM FOR ELECTRICAL INTERCONNECT COMPONENT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/1998
|
Application #:
|
08482000
|
Filing Dt:
|
06/07/1995
|
Title:
|
LOW PROFILE SEMICONDUCTOR DIE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/1997
|
Application #:
|
08487104
|
Filing Dt:
|
06/07/1995
|
Title:
|
COMPUTER SYSTEM HAVING COLOR-CODED PRINTED CIRCUIT BOARDS AND CORRESPONDING SLOTS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/1998
|
Application #:
|
08662278
|
Filing Dt:
|
06/12/1996
|
Title:
|
PASSIVE BACKPLANE CAPABLE OF BEING CONFIGURED TO A VARIABLE DATA PATH WIDTH CORRESPONDING TO A DATA SIZE OF THE PLUGGABLE CPU BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/1998
|
Application #:
|
08685547
|
Filing Dt:
|
07/24/1996
|
Title:
|
COMPUTER SYSTEM HAVING A MOTORIZED DOOR MECHANISM
|
|
|
Patent #:
|
|
Issue Dt:
|
09/22/1998
|
Application #:
|
08702195
|
Filing Dt:
|
08/23/1996
|
Title:
|
COMPUTER HAVING A HIGH DENSITY CONNECTOR SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/1999
|
Application #:
|
08744377
|
Filing Dt:
|
11/07/1996
|
Title:
|
HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/1999
|
Application #:
|
08855368
|
Filing Dt:
|
05/13/1997
|
Title:
|
ELECTRICAL INTERCONNECT SYSTEM WITH WIRE RECEIVING PORTION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/1998
|
Application #:
|
08902032
|
Filing Dt:
|
07/29/1997
|
Title:
|
SEMICONDUCTOR DIE CARRIER HAVING A DIELECTRIC EPOXY BETWEEN ADJACENT LEADS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2001
|
Application #:
|
08911010
|
Filing Dt:
|
08/14/1997
|
Title:
|
ELECTRICAL CONNECTOR ASSEMBLY WITH A FEMALE ELECTRICAL CONNECTOR HAVING INTERNAL FLEXIBLE CONTACT ARM
|
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2000
|
Application #:
|
08911283
|
Filing Dt:
|
08/14/1997
|
Title:
|
ELECTRICAL CONNECTOR HAVING STAGGERED HOLD-DOWN TABS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2000
|
Application #:
|
08921463
|
Filing Dt:
|
09/02/1997
|
Title:
|
COMPUTER SYSTEM HAVING A MODULAR ARCHITECTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/1999
|
Application #:
|
08934330
|
Filing Dt:
|
09/19/1997
|
Title:
|
SEMICONDUCTOR CHIP CARRIER AFFORDING A HIGH-DENSITY EXTERNAL INTERFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2000
|
Application #:
|
08970379
|
Filing Dt:
|
11/14/1997
|
Title:
|
MULTI-CHIP MODULE HAVING INTERCONNECT DIES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/1999
|
Application #:
|
08970434
|
Filing Dt:
|
11/14/1997
|
Title:
|
DECORATIVE PANEL FOR COMPUTER ENCLOSURE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/1999
|
Application #:
|
08970502
|
Filing Dt:
|
11/14/1997
|
Title:
|
INTERFACE OPTIMIZED COMPUTER SYSTEM ARCHITECTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/29/2000
|
Application #:
|
08970503
|
Filing Dt:
|
11/14/1997
|
Title:
|
COOLING SYSTEM FOR SEMICONDUCTOR DIE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2000
|
Application #:
|
09033480
|
Filing Dt:
|
03/03/1998
|
Title:
|
SEMICONDUCTOR DIE PACKAGE FOR MOUNTING IN HORIZONTAL AND UPRIGHT CONFIGURATIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2000
|
Application #:
|
09083083
|
Filing Dt:
|
05/22/1998
|
Title:
|
PASSIVE BACKPLANE CAPABLE OF BEING CONFIGURED TO A VARIABLE DATA PATH WIDTH CORRESPONDING TO A DATA SIZE OF THE PLUGGABLE CPU BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2000
|
Application #:
|
09178650
|
Filing Dt:
|
10/26/1998
|
Title:
|
APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/07/2000
|
Application #:
|
09178650
|
Filing Dt:
|
10/26/1998
|
Title:
|
APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09218180
|
Filing Dt:
|
12/22/1998
|
Title:
|
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/01/2000
|
Application #:
|
09244435
|
Filing Dt:
|
02/04/1999
|
Title:
|
A SEMICONDUCTOR CHIP CARRIER INCLUDING AN
INTERCONNECT COMPONENT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09249300
|
Filing Dt:
|
02/12/1999
|
Title:
|
INTEGRATED CONNECTOR AND SEMICONDUCTOR DIE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2002
|
Application #:
|
09261256
|
Filing Dt:
|
03/03/1999
|
Title:
|
ELECTRICAL CONNECTOR HAVING STAGGERED HOLD-DOWN TABS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2001
|
Application #:
|
09484047
|
Filing Dt:
|
01/18/2000
|
Title:
|
Multi-chip module having interconnect dies
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2003
|
Application #:
|
09536628
|
Filing Dt:
|
03/28/2000
|
Publication #:
|
|
Pub Dt:
|
11/07/2002
| | | | |
Title:
|
MODULAR ARCHITECTURE FOR HIGH BANDWIDTH COMPUTERS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/2003
|
Application #:
|
09631110
|
Filing Dt:
|
08/01/2000
|
Title:
|
SEMICONDUCTOR CHIP CARRIER AFFORDING A HIGH-DENSITY EXTERNAL INTERFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/1996
|
Application #:
|
29019780
|
Filing Dt:
|
03/11/1994
|
Title:
|
COMPUTER CABINET
|
|
|
Patent #:
|
|
Issue Dt:
|
10/31/1995
|
Application #:
|
29019781
|
Filing Dt:
|
03/11/1994
|
Title:
|
COMPUTER CABINET
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/1997
|
Application #:
|
29036617
|
Filing Dt:
|
02/21/1995
|
Title:
|
COMPUTER CABINET
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/1996
|
Application #:
|
29046826
|
Filing Dt:
|
11/16/1995
|
Title:
|
COMPUTER CABINET WITH EXTENDING SPEAKERS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2000
|
Application #:
|
29081929
|
Filing Dt:
|
11/14/1997
|
Title:
|
COMPUTER CABINET
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2001
|
Application #:
|
29092575
|
Filing Dt:
|
08/21/1998
|
Title:
|
COMPUTER CABINET
|
|