Total properties:
23
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Patent #:
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Issue Dt:
|
08/12/1997
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Application #:
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08060614
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Filing Dt:
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05/12/1993
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Title:
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AN APPARATUS FOR TESTING A NONPACKAGED DIE
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Patent #:
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Issue Dt:
|
05/13/1997
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Application #:
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08531367
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Filing Dt:
|
09/20/1995
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Title:
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BUTTON CONTACT FOR SURFACE MOUNTING AC IC DEVICE TO A CIRCUIT BOARD
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Patent #:
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Issue Dt:
|
04/04/2000
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Application #:
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08538956
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Filing Dt:
|
10/04/1995
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Title:
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TEST SOCKET FOR AN IC DEVICE
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Patent #:
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Issue Dt:
|
03/27/2001
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Application #:
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09014100
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Filing Dt:
|
01/27/1998
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Title:
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PROBE TIP AND METHOD FOR MAKING ELECTRICAL CONTACT WITH A SOLDER BALL CONTACT OF AN INTEGRATED CIRCUIR DEVICE
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Patent #:
|
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Issue Dt:
|
04/24/2001
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Application #:
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09032361
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Filing Dt:
|
02/27/1998
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Title:
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IC CHIP SOCKET AND METHOD
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|
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Patent #:
|
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Issue Dt:
|
03/28/2000
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Application #:
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09049802
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Filing Dt:
|
03/27/1998
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Title:
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CONNECTOR, CONNECTOR SYSTEM AND METHOD OF MAKING A CONNECTOR
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09272629
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Filing Dt:
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03/18/1999
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Title:
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COVER ASSEMBLY FOR AN IC SOCKET
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|
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Patent #:
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Issue Dt:
|
05/06/2003
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Application #:
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09542131
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Filing Dt:
|
04/04/2000
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Title:
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TEST SOCKET FOR AN IC DEVICE
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|
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Patent #:
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|
Issue Dt:
|
10/02/2001
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Application #:
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09602924
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Filing Dt:
|
06/22/2000
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Title:
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Test socket and method for testing an IC device in a dead bug orientation
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|
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Patent #:
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|
Issue Dt:
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06/20/2006
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Application #:
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09775676
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Filing Dt:
|
02/01/2001
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Publication #:
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Pub Dt:
|
08/01/2002
| | | | |
Title:
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BUNDLED PROBE APPARATUS FOR MULTIPLE TERMINAL CONTACTING
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|
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Patent #:
|
|
Issue Dt:
|
05/10/2005
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Application #:
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10700401
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Filing Dt:
|
11/03/2003
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Publication #:
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|
Pub Dt:
|
05/05/2005
| | | | |
Title:
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MULTIPATH INTERCONNECT WITH MEANDERING CONTACT CANTILEVERS
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10759338
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Filing Dt:
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01/16/2004
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Publication #:
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Pub Dt:
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07/21/2005
| | | | |
Title:
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SEE-SAW INTERCONNECT ASSEMBLY WITH DIELECTRIC CARRIER GRID PROVIDING SPRING SUSPENSION
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|
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Patent #:
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|
Issue Dt:
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03/13/2007
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Application #:
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11077054
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Filing Dt:
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03/10/2005
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Publication #:
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Pub Dt:
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07/21/2005
| | | | |
Title:
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SEE-SAW INTERCONNECT ASSEMBLY WITH DIELECTRIC CARRIER GRID PROVIDING SPRING SUSPENSION
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Patent #:
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|
Issue Dt:
|
05/15/2007
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Application #:
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11125035
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Filing Dt:
|
05/09/2005
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Publication #:
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|
Pub Dt:
|
09/08/2005
| | | | |
Title:
|
MULTIPATH INTERCONNECT WITH MEANDERING CONTACT CANTILEVERS
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|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
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Application #:
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11177673
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Filing Dt:
|
07/08/2005
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Publication #:
|
|
Pub Dt:
|
03/09/2006
| | | | |
Title:
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MODULAR SEMICONDUCTOR PACKAGE TESTING CONTACTOR SYSTEM
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|
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Patent #:
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|
Issue Dt:
|
05/15/2007
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Application #:
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11198995
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Filing Dt:
|
08/08/2005
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Publication #:
|
|
Pub Dt:
|
02/16/2006
| | | | |
Title:
|
INTERCONNECT ASSEMBLY FOR A PROBE CARD
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|
|
Patent #:
|
|
Issue Dt:
|
07/22/2008
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Application #:
|
11558603
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Filing Dt:
|
11/10/2006
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Title:
|
INTERCONNECT ASSEMBLY FOR TESTING INTEGRATED CIRCUIT PACKAGES
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|
|
Patent #:
|
|
Issue Dt:
|
06/01/2010
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Application #:
|
11671942
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Filing Dt:
|
02/06/2007
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Title:
|
COMPRESSIVE CONDUCTORS FOR SEMICONDUCTOR TESTING
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|
|
Patent #:
|
|
Issue Dt:
|
04/20/2010
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Application #:
|
11671963
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Filing Dt:
|
02/06/2007
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Title:
|
ACTIVE TEST SOCKET
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|
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Patent #:
|
|
Issue Dt:
|
11/20/2007
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Application #:
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11671986
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Filing Dt:
|
02/06/2007
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Title:
|
CRIMPED TUBE ELECTRICAL TEST SOCKET PIN
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|
|
Patent #:
|
|
Issue Dt:
|
10/02/2012
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Application #:
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12054281
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Filing Dt:
|
03/24/2008
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Publication #:
|
|
Pub Dt:
|
09/24/2009
| | | | |
Title:
|
TEST INTERCONNECT
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
12105922
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Filing Dt:
|
04/18/2008
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Publication #:
|
|
Pub Dt:
|
10/22/2009
| | | | |
Title:
|
SPRING PROBE
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|
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Patent #:
|
|
Issue Dt:
|
07/18/2006
|
Application #:
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29194881
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Filing Dt:
|
12/02/2003
|
Title:
|
SHEET METAL INTERCONNECT ARRAY
|
|