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Patent Assignment Details
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Reel/Frame:022576/0752   Pages: 4
Recorded: 04/17/2009
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/13/2010
Application #:
12383524
Filing Dt:
03/24/2009
Publication #:
Pub Dt:
10/01/2009
Title:
COPPER INTERCONNECTION STRUCTURE, BARRIER LAYER INCLUDING CARBON AND HYDROGEN
Assignor
1
Exec Dt:
03/12/2009
Assignee
1
1-1, KATAHIRA 2-CHOME
AOBA-KU
SENDAI-SHI MIYAGI, JAPAN 980-8577
Correspondence name and address
MASUVALLEY & PARTNERS, TATSUO BABA
8765 AERO DRIVE, SUITE 312
SAN DIEGO, CALIFORNIA 92123

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