Patent Assignment Details
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| Reel/Frame: | 022649/0338 | |
| Pages: | 4 |
| | Recorded: | 05/06/2009 | | |
| Attorney Dkt #: | 027968-000300US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12436728
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Filing Dt:
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05/06/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Title:
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Method Of Producing Bonded Wafer
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Assignee
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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Correspondence name and address
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BABAK KUSHA
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER, EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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