Patent Assignment Details
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| Reel/Frame: | 022731/0655 | |
| Pages: | 4 |
| | Recorded: | 05/26/2009 | | |
| Attorney Dkt #: | 125.018US05 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/2009
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Application #:
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11870564
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Filing Dt:
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10/11/2007
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Publication #:
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Pub Dt:
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01/31/2008
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Title:
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METHOD OF FORMING AN INTEGRATED CIRCUIT HAVING A DEVICE WAFER WITH A DIFFUSED DOPED BACKSIDE LAYER
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Assignee
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| 1025 WEST NASA BLVD. |
| MELBOURNE, FLORIDA 32919 |
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Correspondence name and address
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FOGG & POWERS LLC
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5810 W 78TH STREET
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SUITE 100
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MINNEAPOLIS, MN 55439
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