Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 022747/0148 | |
| Pages: | 6 |
| | Recorded: | 05/28/2009 | | |
| Attorney Dkt #: | P26095 (77.200) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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11755733
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Filing Dt:
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05/30/2007
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED INTERPOSER WITH THROUGH-SILICON-VIAS
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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KONRAD RAYNES AND VICTOR LLP
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315 S. BEVERLY DR.
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SUITE 210
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BEVERLY HILLS, CA 90212
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