Patent Assignment Details
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| Reel/Frame: | 022748/0779 | |
| Pages: | 3 |
| | Recorded: | 05/22/2009 | | |
| Attorney Dkt #: | 040894-7359 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11302503
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Filing Dt:
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12/14/2005
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Publication #:
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Pub Dt:
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08/03/2006
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Title:
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Ultrasonic wire bonding method and ultrasonic wire bonding apparatus
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Assignee
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| 1500, MISHUKU, SUSONO-SHI |
| SHIZUOKA, JAPAN |
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Correspondence name and address
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MORGAN, LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVE., N.W.
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WASHINGTON, D.C. 20004
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