Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 022802/0492 | |
| Pages: | 4 |
| | Recorded: | 05/29/2009 | | |
| Attorney Dkt #: | 84192(70840) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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12455169
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Filing Dt:
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05/29/2009
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Publication #:
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Pub Dt:
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12/03/2009
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Title:
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ELECTRONIC ELEMENT WAFER MODULE WITH REDUCED WARPING
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Assignee
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| 22-22, NAGAIKE-CHO |
| ABENO-KU, OSAKA-SHI |
| OSAKA 545-8522, JAPAN |
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Correspondence name and address
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DAVID G. CONLIN
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EDWARDS ANGELL PALMER & DODGE LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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