Patent Assignment Details
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| Reel/Frame: | 022847/0102 | |
| Pages: | 2 |
| | Recorded: | 06/18/2009 | | |
| Attorney Dkt #: | 3531.85116 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12487436
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Filing Dt:
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06/18/2009
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Publication #:
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Pub Dt:
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01/07/2010
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Title:
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Method of dividing a semiconductor wafer utilizing a laser dicing technique
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Assignee
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU |
| TOKYO, JAPAN 143-8580 |
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Correspondence name and address
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GREER, BURNS & CRAIN
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300 S WACKER DR
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25TH FLOOR
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CHICAGO, IL 60606
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