Patent Assignment Details
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| Reel/Frame: | 022859/0149 | |
| Pages: | 2 |
| | Recorded: | 06/22/2009 | | |
| Attorney Dkt #: | 3304.2.396 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12489120
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Filing Dt:
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06/22/2009
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Publication #:
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Pub Dt:
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10/28/2010
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Title:
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HEAT-DISSIPATING AND FIXING MECHANISM OF ELECTRONIC COMPONENT AND PROCESS FOR ASSEMBLING SAME
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Assignee
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| NO. 31-1, SHIEN PAN ROAD, KUEI SAN INDUSTRIAL ZONE |
| TAOYUAN HSIEN, TAIWAN 333 |
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Correspondence name and address
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THOMAS M. HARDMAN
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170 SOUTH MAIN STREET, SUITE 735
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SALT LAKE CITY, UT 84101
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