Patent Assignment Details
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| Reel/Frame: | 022906/0355 | |
| Pages: | 3 |
| | Recorded: | 07/02/2009 | | |
| Attorney Dkt #: | P2874US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12488791
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Filing Dt:
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06/22/2009
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Publication #:
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Pub Dt:
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10/03/2013
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Title:
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THERMAL INTERFACE MATERIAL FOR SEMICONDUCTOR CHIP AND METHOD FOR FORMING THE SAME
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Assignee
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| 148-29 GASAN-DONG, GEUMCHEON-GU |
| SEOUL, KOREA, REPUBLIC OF 153-801 |
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Correspondence name and address
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H.C. PARK & ASSOCIATES, PLC
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8500 LEESBURG PIKE, SUITE 7500
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VIENNA, VA 22182
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