Patent Assignment Details
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| Reel/Frame: | 022945/0697 | |
| Pages: | 2 |
| | Recorded: | 07/01/2009 | | |
| Attorney Dkt #: | FUJI-219 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/01/2011
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Application #:
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12458149
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Filing Dt:
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07/01/2009
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Publication #:
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Pub Dt:
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01/14/2010
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Title:
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JOINED WAFER, FABRICATION METHOD THEREOF, AND FABRICATION METHOD OF SEMICONDUCTOR DEVICES
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Assignee
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| 550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI |
| TOKYO, JAPAN 193-8550 |
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Correspondence name and address
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STEVEN M. RABIN
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RABIN & BERDO, PC
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1101 14TH ST., NW
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SUITE 500
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WASHINGTON, DC 20005
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