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Total properties:
23
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Patent #:
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Issue Dt:
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01/07/1997
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Application #:
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08144981
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Filing Dt:
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10/28/1993
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Title:
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SOLDER BALL INTERCONNECTED ASSEMBLY
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Patent #:
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Issue Dt:
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01/30/1996
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Application #:
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08342533
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Filing Dt:
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11/21/1994
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Title:
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A METHOD FOR MAKING PRINTED CIRCUIT BOARDS WITH SELECTIVELY FILLED PLATED THROUGH HOLES
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Patent #:
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Issue Dt:
|
09/24/1996
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Application #:
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08463344
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Filing Dt:
|
06/05/1995
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Title:
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METHOD OF PREPARING A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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10/14/1997
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Application #:
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08474343
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Filing Dt:
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06/07/1995
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Title:
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SOLDER BALL CONNECTIONS AND ASSEMBLY PROCESS
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Patent #:
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Issue Dt:
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08/12/1997
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Application #:
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08585819
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Filing Dt:
|
01/16/1996
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Title:
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ELECTROPLATING APPARATUS
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Patent #:
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Issue Dt:
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09/30/1997
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Application #:
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08633322
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Filing Dt:
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04/17/1996
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Title:
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PROCESS FOR SELECTIVE APPLICATION OF SOLDER TO CIRCUIT PACKAGES
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Patent #:
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Issue Dt:
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01/07/2003
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Application #:
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08640645
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Filing Dt:
|
05/01/1996
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Title:
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SOLDER BALL CONNECTIONS AND ASSEMBLY PROCESS
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Patent #:
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Issue Dt:
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10/20/1998
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Application #:
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08849578
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Filing Dt:
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06/03/1997
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Title:
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ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN
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Patent #:
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Issue Dt:
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05/09/2000
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Application #:
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08882458
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Filing Dt:
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06/25/1997
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Title:
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METHOD FOR ESTABLISHING ELECTRICAL COMMUNICATION BETWEEN A FIRST OBJECT HAVING A SOLDER BALL AND A SECOND OBJECT
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Patent #:
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Issue Dt:
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08/04/1998
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Application #:
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08883112
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Filing Dt:
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06/26/1997
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Title:
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BARE DIE MULTIPLE DIES FOR DIRECT ATTACH
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09033505
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Filing Dt:
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03/02/1998
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Title:
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LAMINATE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09159360
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Filing Dt:
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09/23/1998
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Title:
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METHOD OF PREPARING A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09185425
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Filing Dt:
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11/03/1998
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Title:
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THERMAL DEFORMATION MANAGEMENT FOR CHIP CARRIERS
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09314003
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Filing Dt:
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05/19/1999
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Title:
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ROBUST INTERCONNECT STRUCTURE
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09347580
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Filing Dt:
|
07/01/1999
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|
Title:
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WIRE BONDING METHOD AND APPARATUS
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|
|
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Patent #:
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|
Issue Dt:
|
10/10/2000
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Application #:
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09365683
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Filing Dt:
|
08/02/1999
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Title:
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NICKEL ALLOY FILMS FOR REDUCED INTERMETALLIC FORMATION IN SOLDER
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09388753
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Filing Dt:
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09/02/1999
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Title:
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SUBSTRATE STRUCTURE FOR IMPROVING ATTACHMENT RELIABILITY OF SEMICONDUCTOR CHIPS AND MODULES
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Patent #:
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Issue Dt:
|
06/26/2001
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Application #:
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09388755
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Filing Dt:
|
09/02/1999
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Title:
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METHOD FOR IMPROVING ATTACHMENT RELIABILITY OF SEMICONDUCTOR CHIPS AND MODULES
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Patent #:
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Issue Dt:
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01/01/2002
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Application #:
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09510996
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Filing Dt:
|
02/22/2000
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Title:
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Method for preparing a conductive pad for electrical connection and conductive pad formed
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09641413
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Filing Dt:
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08/18/2000
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Title:
|
NICKEL ALLOY FILMS FOR REDUCED INTERMETALLIC FORMATION IN SOLDER
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|
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Patent #:
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Issue Dt:
|
07/19/2005
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Application #:
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09768372
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Filing Dt:
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01/23/2001
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Publication #:
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Pub Dt:
|
06/28/2001
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Title:
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STRESS ACCOMMODATION IN ELECTRONIC DEVICE INTERCONNECT TECHNOLOGY FOR MILLIMETER CONTACT LOCATIONS
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/19/2004
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Application #:
|
10078020
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Filing Dt:
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02/15/2002
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Publication #:
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Pub Dt:
|
08/21/2003
| | | | |
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Title:
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LEAD-FREE TIN-SILVER-COPPER ALLOY SOLDER COMPOSITION
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|
|
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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10314498
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Filing Dt:
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12/06/2002
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Publication #:
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Pub Dt:
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06/10/2004
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Title:
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STRUCTURE AND METHOD FOR LEAD FREE SOLDER ELECTRONIC PACKAGE INTERCONNECTIONS
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